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Smart home solution 2025-03-25 15:20:32 1,634

Electric vehicle OBC (on-board charger): TOLL package parallel design

Electric vehicle OBC (on-board charger): TOLL package parallel design

IMWTEK UP006N08CT and Infineon OptiMOS ™  LLC resonance current sharing and high-frequency efficiency breakthrough of 6

1、 Application scenarios and technical challenges

The on-board charger (OBC) for electric vehicles needs to efficiently convert AC power into high-voltage DC power (such as 400V/800V), and the synchronous rectification MOSFET in its LLC resonant topology faces the following challenges:

High frequency requirements: In order to reduce the volume of magnetic components, the switching frequency needs to be increased to 80-100kHz, but high frequency will increase switching losses and drive difficulty.

Multi chip parallel current sharing: A single MOSFET is difficult to carry>30A current, and when multiple MOSFETs are connected in parallel, current imbalance occurs due to differences in parasitic parameters.

Vehicle reliability: requires AEC-Q101 certification and can withstand temperature cycling (-40 ° C to 150 ° C) and mechanical shock (50G).

The TOLL (TO Leadless) package is an ideal choice for high-frequency OBC due to its low parasitic inductance (<2nH) and bottom heat dissipation pads.

2、 Product comparison: IMWTEKUP006N08CT vs. Infineon OptiMOS ™  6 BSC010N06LS6

Advantage analysis of parameter IMWTEK UP006N08CT Infineon BSC010N06LS6

Encapsulation TOLL-8 TOLL-8 with packaging benchmarking

Voltage level: 80V, 60V, 80V, suitable for 800V battery system's remaining capacity requirements

RDS (on) @ 10V 0.95m Ω 1.1m Ω reduces conduction loss by 13.6%

Qg (total) 32nC 38nC reduces driving loss by 15.8%

Thermal resistance R θ JA 25 ° C/W 30 ° C/W, with the same power consumption, the junction temperature is 5-7 ° C lower

Reverse recovery charge Qrr 20nC 35nC dead time loss reduced by 42%

3、 Practical testing: Verification of 11kW OBC LLC resonant module

Testing Platform:

Input/Output: AC 220V/50Hz → DC 800V/14A

Topology: Two phase interleaved LLC resonance+synchronous rectification

Switching frequency: 80kHz (full load)/40kHz (light load)

Cooling conditions: Liquid cooled plate (coolant flow rate 2L/min, inlet temperature 65 ° C)

Test project:

Efficiency and temperature rise: overall efficiency and MOSFET junction temperature distribution.

Current sharing performance: current imbalance degree (Δ I/I2 avg) when 4 wires are connected in parallel.

EMC compliance: CISPR 25 Class 5 radiated noise test.

Test results:

Efficiency performance:

IMWTEK UP006N08CT: The peak efficiency is 96.8% (Infineon solution 95.5%), and the difference in full load efficiency has widened to 1.8%.

Loss decomposition (Figure 1): The switching loss (Psw) of IMWTEK decreased by 28%, and the Qrr related loss decreased by 50%.

Current sharing performance:

IMWTEK UP006N08CT: When 4 are connected in parallel, Δ I/I2 avg is less than 4% (Infineon's solution is 7%), thanks to the symmetrical pin layout of the TOLL package.

Current waveform (Figure 2): The current overlap of each channel in IMWTEK reaches 95%, and Infineon experiences phase shift due to differences in parasitic inductance.

EMC testing:

IMWTEK UP006N08CT: Noise in the 30-100MHz frequency band is 6dB below the limit (Infineon's solution only meets the limit).

Spectrum comparison (Figure 3): The dV/dt of IMWTEK is suppressed to 20V/ns (compared to 35V/ns for competitors).

4、 Design suggestion: TOLL package parallel current sharing and heat dissipation optimization

Uniform current layout design:

Star shaped symmetrical wiring (Figure 4): Lead the driving signal out from the center point, ensuring that the length difference of the gate paths of each tube is less than 1mm.

Source Kelvin detection: Add independent sampling lines (with a line width of 0.5mm) to monitor the current of each MOSFET in real-time.

Drive circuit optimization:

Active Miller Clamp: Integrated UCC27611 driver, clamp the Miller platform voltage to below 2V to prevent false triggering.

Dynamic gate resistance: Use a 10 Ω resistor for light load (noise reduction), switch to 2 Ω for full load (acceleration).

Liquid cooling heat dissipation scheme:

The TOLL bottom pad is directly soldered to a copper aluminum composite substrate (thickness 3mm), reducing the thermal resistance to 18 ° C/W.

Channel design (Figure 5): The serpentine channel covers the MOSFET area, with a voltage drop of<0.2 Bar, to avoid local boiling.

5、 Cost and reliability analysis

BOM cost:

The price of a single TOL-80B40 is 12% lower than that of the Infineon BSC010N06LS6, and the efficiency improvement can reduce the power of the liquid cooling pump.

Based on a scale of 100000 sets of OBC, the annual cost savings are approximately $300000.

Reliability verification:

Temperature shock test:- Cycle 1000 times from 40 ° C to 125 ° C, and the shear force of the solder joint remains>4kgf (reduced to 3.2kgf in the Infineon solution).

Corrosion resistance test: After 1000 hours of testing with a mixture of 85 ° C/85% RH and 3.5% salt spray, the pins showed no corrosion.

6、 Industry Trends and Competitive Strategies

With the popularization of the 800V platform, the demand for OBC power density has increased from 3kW/L to 5kW/L. IMWTEKUP006N08CT has entered the supply chains of BYD and Tesla through TOLL packaging and copper clip bonding technology.

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